A 43-year-old Russian engineer, identified as German A., has been arrested for allegedly stealing confidential technical documents from leading semiconductor companies ASML and NXP to help Russia develop 28-nanometer chip manufacturing capabilities.
According to investigators, German A. obtained over 190 classified documents from multiple semiconductor firms including ASML, NXP, TSMC, and GlobalFoundries. The stolen materials included semiconductor production manuals and technical specifications for chipmaking equipment.
While the documents did not contain complete blueprints for fabrication facilities, authorities believe the information could help establish basic semiconductor production lines capable of 28nm chips - a technology node suitable for military applications. The suspect allegedly shared the data through cloud storage, messaging apps, and physical handovers in Moscow, receiving approximately €40,000 for his efforts.
The engineer's career spans multiple semiconductor companies, including internships at Imec and positions at GlobalFoundries, Mapper, ASML, and NXP. At ASML, he worked on electro-optical components until 2021. He later joined NXP as a process technician in 2022.
Dutch intelligence agencies flagged suspicious activities in August 2024, leading to his arrest. Both ASML and NXP have filed formal complaints against their former employee. Investigators suspect connections to Russian intelligence services.
The case highlights ongoing industrial espionage risks in the semiconductor industry. While individual actors cannot steal complete fab designs, coordinated networks of operatives could potentially piece together enough technical data to advance semiconductor capabilities in restricted nations.
In response, semiconductor companies have enhanced security measures, implementing stricter access controls between departments and increased monitoring of employee activities. The suspect now faces between 18 to 32 months in prison if convicted.